乐泰产品loctite3541/3542单组份热容结构胶应用:粘接,密封,联接,具体应用包括视窗粘接、外壳结构粘接、电池粘接、触摸屏组装、 键盘粘接、平面密封、PCB组装适用基材:对塑料,油墨,金属,玻璃等粘接效果非常好汉高乐泰配套设备:30ml针筒热熔胶粘剂点胶设备成功案例:Loctite 3541,3542为Nokia,Moto等多款手机指定结构胶水,抗老化,跌落,高温高湿等.
PRODUCT DESCRIPTION
LOCTITE 3541 is a reactive hot-melt adhesive based on polyurethane prepolymers. The adhesive is pressure sensitive and gives a high initial strength instantly after joining the parts. Additionally it has a long open time to be suitable for automatic or manual assembly line.
The adhesive provides the following characteristics:
Colour: | Transparent when molten, after cooling light ivory |
Odour: | Weak |
Density: | 1.15±0.05g/cm3 |
Solids: | 100% |
Voiscosity: | 6000-10000mPa.s @110degC |
Equipment: | Brookfield Thermosel, Spindle 27 |
Open time: | 2-4 min |
ApplicationTemperature: | 110 to 140 degC |
Temperature resistance: Short-term (up to 1 h) | -30 to 100 degC-30 to 120 degC |
Pretreatment
The bonding surfaces must be clean, dry and free of oil and grease. Substrate temperature should not fall below 20degC during application. Lower temperatures will lead to and early solidification of the adhesive and thus to a reduced open time, possibly the adhesive might even flake off. If necessary the substrates may be preheated, however longer open times and thus extended cycle times will have to be taken into consideration at temperatures above 45degC.
Application
LOCTITE 3541 can be applied from heatable cartridge guns, from usual syringe type melting equipment. At longer rest periods melting and application temperatures should be decreased. Longer exposure to higher temperatures can lead to a viscosity increase.
Curing
LOCTITE 3541 cures exclusively by moisture and gains its final strength after 1-5 days, but exhibits high handling strength instantly after joining.
Curing is a chemical reaction depending on the following
parameters:
- Humidity in the rooms of application and storage
- Humidity of the substrates
- Permeability of the substrates to be bonded
- Application weight/ layer of the adhesive film