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深圳市联特永固电子材料有限公司

胶粘剂,封装胶,灌封胶,导热硅胶,防水防潮,固定胶,包封胶,粘结胶,水胶,填充胶,防焊...

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手机组装触摸屏装配乐泰loctite3541/3542单组份结构胶
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产品: 浏览次数:5540手机组装触摸屏装配乐泰loctite3541/3542单组份结构胶 
单价: 1.00元/1.00元
最小起订量: 1 1.00元
供货总量:
发货期限: 自买家付款之日起 天内发货
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详细信息

乐泰产品loctite3541/3542单组份热容结构胶应用:粘接,密封,联接,具体应用包括视窗粘接、外壳结构粘接、电池粘接、触摸屏组装、 键盘粘接、平面密封、PCB组装适用基材:对塑料,油墨,金属,玻璃等粘接效果非常好汉高乐泰配套设备:30ml针筒热熔胶粘剂点胶设备成功案例:Loctite 3541,3542为Nokia,Moto等多款手机指定结构胶水,抗老化,跌落,高温高湿等.

PRODUCT DESCRIPTION

LOCTITE 3541 is a reactive hot-melt adhesive based on polyurethane prepolymers.   The adhesive is pressure sensitive and gives a high initial strength instantly after joining the parts. Additionally it has a long open time to be suitable for automatic or manual assembly line.

The adhesive provides the following characteristics:

Colour:Transparent when molten, after cooling light ivory
Odour:Weak
Density:1.15±0.05g/cm3
Solids:100%
Voiscosity:6000-10000mPa.s  @110degC
Equipment:Brookfield Thermosel, Spindle 27
Open time:2-4 min
ApplicationTemperature:110 to 140 degC
Temperature resistance: Short-term (up to 1 h)-30 to 100 degC-30 to 120 degC

Pretreatment

The bonding surfaces must be clean, dry and free of oil and grease.    Substrate temperature  should not fall below 20degC during application.   Lower temperatures will lead to and early solidification of the adhesive and thus to a reduced open time, possibly the adhesive might even flake off.  If necessary the substrates may be preheated, however longer open times and thus extended  cycle times  will have  to be taken  into consideration at temperatures above 45degC.

Application

LOCTITE  3541 can be applied  from heatable  cartridge  guns, from  usual  syringe  type  melting  equipment.    At  longer  rest periods melting and application temperatures should be decreased.   Longer exposure to higher temperatures  can lead to a viscosity increase.

Curing

LOCTITE  3541  cures  exclusively  by  moisture  and  gains  its final strength after 1-5 days, but exhibits high handling strength instantly after joining.

Curing  is  a  chemical  reaction  depending   on  the  following
parameters:
-       Humidity in the rooms of application and storage
-       Humidity of the substrates
-       Permeability of the substrates to be bonded
-       Application weight/ layer of the adhesive film

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