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无铅焊锡条 ECO SOLDER BAR
焊锡条是采用各种高纯度金属原料，在严格的管理条件下，进行生产而成的，锡条表面有光泽，纯度高。熔化后流动性好，热循环优越，浸润性及可焊性良好，氧化物残渣产生较少，其不同合金锡条被广泛应用于各类高品质要求的波峰焊接之产品和电镀等工艺。
Senju ECO Solder Paste M705-GRN360-KV series has been development as a result of many years experience working with customers using Lead-free soldering in production. It features improved thermal properties required for high-density applications with BGA’s and CSP’s devices.
Other benefits include;
• Very stable solder paste viscosity over a longer period
• Clear flux residues combined with excellent joint cosmetics
• Excellent wettability
• Reduced flux residue cracking and occurrence of side balling
| Sn 96.5 Ag 3 Cu 0.5 | Sn 96.5 Ag 3 Cu 0.5 | A30C5 | M705 |
| Remain | 0.10 max | 0.10 max | 0.10 max | 0.3 to 0.7 | 0.05 max | 0.10 max | 2.8 to 3.2 | 0.001 max | 0.03 max | 0.002 max | 0.02 max | 0.01 max | 0.001 max |