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Features & Benefits

Ultra-low capacitance (0.05pF typ.) ideal for high speed data applicationsProvides ESD protection with fast response time (<1ns) allowing equipment to pass IEC 61000-4-2 level 4 testSingle-line, bi-directional device for placement flexibilityLow profile 0402/1005 design for board space savingsLow leakage current (<0.1nA typ.) reduces power con

Environmental Specifications:

Load Humidity: 12VDC per EIA/IS-772 Para. 4.4.2, +85°C, 85% RH for 1000hoursThermal Shock: EIA/IS-722 Para 4.6, Air to Air -55°C to +125°C, 5 cyclesMoisture Resistance Test: MIL-STD-202G Method 106G, 10 cyclesMechanical Shock: EIA/IS-722 Para. 4.9Vibration: EIA/IS-722 Para. 4.10Resistance to Solvent: EIA/ IS -722 Para. 4.11Operating & Storage Temperature Range: -55°C to +125°C

Soldering Recommendations

Compatible with lead and lead-free solder reflow processesPeak reflow temperatures and durations:IR Reflow = 260°C max for 10 sec. max.Wave Solder = 260°C max