| 起订: | 供货总量: |
| 发货期限: 自买家付款之日起 天内发货 | 所在地: 江苏 苏州市 |
| 有效期至： 长期有效 | 品牌： |
详情介绍
ITEMSPERFORMANCETEST METHODSOLDER POWDERAlloy compositionAg3.0-Cu0.5-Sn---Melting pointSolidus 217CPeak/Liquidus 219CDSCPowder shapeSphericalSEMParticle size25~36umSEM and Laser methodFLUXFlux typeROJ-STD-004Flux activityL0J-STD-004Halide content0.0%JIS Z 3197Halogen contentNo addedEN 14582Surface insulation resistance(40C90%RH,168hr)Over
1.0E+12JIS Z 3284Electrochemical migration85C85%RH Bias DC45V，1000hr)Pass (No migration)Over
1.0E+9JIS Z 3284Copper mirror testPassJIS Z 3197SOLDER PASTEViscosity200Pa.sJIS Z 3284Thixotropy index0.60JIS Z 3284Flux content11.2%JIS Z 3197Slump in heating0.3mm MaxJIS Z 3284Tackiness1.3N/over 24hJIS Z 3284Copper plate corrosion testPassJIS Z 3197Validity6 monthUnopened,keep condition 0-10C
1.0E+12JIS Z 3284Electrochemical migration85C85%RH Bias DC45V，1000hr)Pass (No migration)Over
1.0E+9JIS Z 3284Copper mirror testPassJIS Z 3197SOLDER PASTEViscosity200Pa.sJIS Z 3284Thixotropy index0.60JIS Z 3284Flux content11.2%JIS Z 3197Slump in heating0.3mm MaxJIS Z 3284Tackiness1.3N/over 24hJIS Z 3284Copper plate corrosion testPassJIS Z 3197Validity6 monthUnopened,keep condition 0-10C
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